AI cloud and on premises processing will significantly benefit from FMC's hybrid memory technology. Data-intensive AI tasks require optimization, and while the entire industry struggles to reduce the "memory wall" effect by speeding up interconnections between various memory layers (Cache, DRAM, persistent storage) FMC’s memory eliminates the need for interconnects by unifying these layers. This approach achieves two key goals:
1) Removing barriers to the growth of data centers, AI training, and inference.
2) Reducing the cost of AI tasks by lowering data center expenses.

A wide range of other applications will also benefit from combining volatile and non-volatile memory hierarachies, offering ultra-low power operation and high performance at an affordable, DRAM-like cost.
Thanks to exceptional temperature stability of FE-HfO₂, automotive and industrial sectors represent long-term markets for this technology.
Power aware devices in sectors like healthcare, medical, industrial, and IoT will also see substantial benefits from the technology.
Furthermore, due to the inherent tamper resistance of ferroelectrics, ferroelectric memory will be invaluable in applications that prioritize data security.