by Frend | aug 15, 2025 | Uncategorized
GO BACK FMC and CEA‑Leti Join Forces to Advance FeRAM CACHE+ Memory for the AI Era The future of AI depends on memory innovation. That was the clear message from a recent conversation between Thomas Rueckes, CEO of FMC, and Jean‑René Lèquepeys, Deputy Director and CTO...
by Frend | aug 15, 2025 | Uncategorized
GO BACK Breaking the Memory Wall. Building the backbone for next-generation computing. The bottleneck slowing progress The future of computing is running into a stubborn constraint.Memory is fast but forgetful. Storage remembers, but it is too slow. This gap between...
by Frend | aug 15, 2025 | Uncategorized
GO BACK IPCEI Microelectronics and Communication Technologies – Ferroelectric Memory Microelectronics is an economic multiplier for almost all relevant economic sectors and has a decisive influence on how innovative and therefore economically successful Europe...
by Frend | aug 15, 2025 | Uncategorized
GO BACK Hardware-based AI with 3-dimensional ferroelectric memories Artificial intelligence (AI) is considered a cross-industry driver of innovation and growth, but powerful models lead to a sharp increase in energy and water consumption due to cooling in data...
by Frend | aug 15, 2025 | Uncategorized
GO BACK The memory arms race. How FMC is ending the trade-off era. Every technological revolution has a single constraint that shapes its trajectory. Today, as AI systems, hyperscale data centers, and cloud networks scale at unprecedented speed, the defining...
by Frend | aug 17, 2025 | Uncategorized
GO BACK The Future of Memory and Storage (FMS) 2025 “Only a “Low Cost Adder” with >90% reuse from DRAM or NAND process can EVER ramp as a high volume technology. FE Capacitor DRAM is the ideal candidate due to tools and processes. FMC (FerroElectric Memory...
