Persistent Memory Solutions for Efficient AI Scale-out

The Memory Revolution that powers
critical infrastructure

Hardware-based AI with 3-dimensional ferroelectric memories

GO BACK Artificial intelligence (AI) is considered a cross-industry driver of innovation and growth, but powerful models lead to a sharp increase in energy and water consumption due to cooling in data centers. The training of a single advanced AI model, for example...

read more
Hardware-based AI with 3-dimensional ferroelectric memories

Hardware-based AI with 3-dimensional ferroelectric memories

GO BACK Artificial intelligence (AI) is considered a cross-industry driver of innovation and growth, but powerful models lead to a sharp increase in energy and water consumption due to cooling in data centers. The training of a single advanced AI model, for example...

The memory arms race. How FMC is ending the trade-off era.

GO BACK Every technological revolution has a single constraint that shapes its trajectory. Today, as AI systems, hyperscale data centers, and cloud networks scale at unprecedented speed, the defining constraint is no longer processing power. It is memory. For decades,...

read more
The memory arms race. How FMC is ending the trade-off era.

The memory arms race. How FMC is ending the trade-off era.

GO BACK Every technological revolution has a single constraint that shapes its trajectory. Today, as AI systems, hyperscale data centers, and cloud networks scale at unprecedented speed, the defining constraint is no longer processing power. It is memory. For decades,...

The Future of Memory and Storage (FMS) 2025

GO BACK “Only a “Low Cost Adder” with >90% reuse from DRAM or NAND process can EVER ramp as a high volume technology. FE Capacitor DRAM is the ideal candidate due to tools and processes. FMC (FerroElectric Memory Corporation) Publicized FE based NV DRAM in 2025....

read more
The Future of Memory and Storage (FMS) 2025

The Future of Memory and Storage (FMS) 2025

GO BACK “Only a “Low Cost Adder” with >90% reuse from DRAM or NAND process can EVER ramp as a high volume technology. FE Capacitor DRAM is the ideal candidate due to tools and processes. FMC (FerroElectric Memory Corporation) Publicized FE based NV DRAM in 2025....

FMC’s memory technology to power real-time, data-driven decisions in critical enterprises applications across Europe and beyond. From AI data centers to industrial and automotive systems, FMC’s memory delivers the persistent, high-performance, low power storage that next-generation AI applications demand.

Persistent + Fast

DRAM speed with
media persistence

Energy-Efficient

Enables efficient-AI
scale-out

High volume manufacturing

Seamless integration in
existing factory processes

Let’s build the future of memory together

DRAM-Class Speed. Flash-Class Persistence.

DRAM+

Persistent Memory Modules
Combine speed of DRAM with data retention for AI training & low-power systems

CACHE+

Persistent CACHE+ Chiplets
Increase your inference performance with high density and persistent CACHE+

Leading the Memory Revolution
What drives FMC to redefine what memory can do

Europe cannot lead in AI without mastering memory. FMC’s DRAM+ and CACHE+ are more than technologies—they’re our path to digital sovereignty and sustainable performance.

Jean-René Lèquepeys | Deputy Director and CTO CEA-Leti

Behind the Breakthrough From Lab to Impact

An in-depth look into the people, science and insights behind FMC’s technology. For innovators and bold decision-makers.

Inside the Memory Shift

A thought leader series by FMC on the future of memory. Experts reveal how DRAM+ and CACHE+ technology is reshaping AI and infrastructure.
Fast, persistent, and ready to scale.

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